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bn:02485479n
Noun Concept
Categories: Electronics manufacturing, Packaging (microfabrication), Chemical bonding, Semiconductor technology, Wafer bonding
EN
wafer bonding
EN
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems, nanoelectromechanical systems, microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. Wikipedia
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EN
Wafer bonding is a packaging technology on wafer-level for the fabrication of microelectromechanical systems, nanoelectromechanical systems, microelectronics and optoelectronics, ensuring a mechanically stable and hermetically sealed encapsulation. Wikipedia
packaging technology on wafer-level for the fabrication of microelectromechanical systems etc., ensuring a mechanically stable and hermetically sealed encapsulation Wikidata
HAS KIND
Adhesive bonding of semiconductor wafers
Wikipedia
EN
wafer bonding
Wikidata
EN
wafer bonding

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