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bn:00613858n
Noun Concept
Categories: All articles needing additional references, Printed circuit board manufacturing
EN
reflow soldering  Infrared Soldering  Hot air reflow  Paste in hole  Pin and paste
EN
Reflow soldering is a process in which a solder paste is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. Wikipedia
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Sources
EN
Reflow soldering is a process in which a solder paste is used to temporarily attach one or thousands of tiny electrical components to their contact pads, after which the entire assembly is subjected to controlled heat. Wikipedia
Electronics soldering process Wikidata
IS A
bonding
Wikipedia
EN
reflow soldering
Wikidata
EN
reflow soldering
Wikipedia Redirections
EN
Hot air reflow, Infrared soldering, Infrared Soldering, Paste in hole, Pin and paste, reflow, reflow solder, Reflow Soldering, reflowing, through-hole reflow, Through-hole reflow soldering

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