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Noun Concept

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Deep reactive-ion etching is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios. Wikipedia

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IS A

τεχνολογία

χάραξη

PART OF

κατασκευή συσκευών ημιαγωγών

HAS KIND

Advanced Silicon Etch