bn:01787762n
Noun Concept
Categories: Semiconductor device fabrication, Microtechnology, Etching (microfabrication)
EN
deep reactive-ion etching  Bosch process  deep reactive ion etching  DRIE
EN
Deep reactive-ion etching is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios. Wikipedia
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EN
Deep reactive-ion etching is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios. Wikipedia