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bn:01787762n
Noun Concept
Categories: Etching (microfabrication), Microtechnology, Semiconductor device fabrication
EN
deep reactive-ion etching  Bosch process  deep reactive ion etching  DRIE
EN
Deep reactive-ion etching is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios. Wikipedia
Definitions
Relations
Sources
EN
Deep reactive-ion etching is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios. Wikipedia
IS A
technology
etching
PART OF
semiconductor device fabrication
HAS KIND
Advanced Silicon Etch
Wikipedia
EN
deep reactive-ion etching
Wikidata
EN
deep reactive-ion etching
Wikipedia Redirections
EN
Bosch process (microfabrication), deep reactive ion etching, DRIE

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