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bn:01787762n
Noun Concept
SYL
No term available
EN
Deep reactive-ion etching is a highly anisotropic etch process used to create deep penetration, steep-sided holes and trenches in wafers/substrates, typically with high aspect ratios. Wikipedia
Relations
Sources
IS A
EN
technology
EN
etching
PART OF
EN
semiconductor device fabrication
HAS KIND
EN
Advanced Silicon Etch

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