Login Preferences
About News Publications Statistics Downloads API Guide License How to use Preferences
bn:03300132n
Noun Concept
Categories: Packaging (microfabrication), Semiconductor device fabrication, Chip carriers
EN
integrated circuit packaging  area array package  Die attaching  die attachment  IC encapsulation
EN
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. Wikipedia
Definitions
Relations
Sources
EN
Integrated circuit packaging is the final stage of semiconductor device fabrication, in which the die is encapsulated in a supporting case that prevents physical damage and corrosion. Wikipedia
Final stage in construction of an integrated circuit Wikipedia Disambiguation
Final stage of semiconductor device fabrication Wikidata
HAS KIND
pin grid array
Wikipedia
EN
integrated circuit packaging
Wikidata
EN
Integrated circuit packaging
Wikipedia Redirections
EN
area array package, Die attaching, die attachment, IC encapsulation, IC packaging, Integrated circuit encapsulation, Microelectronics packaging, packaging (microfabrication), semiconductor packaging

Please note that, in order to improve your browsing experience on this website, BabelNet® uses various types of cookies, including: browsing functionality, performance and statistical cookies.

By continuing to browse the site you are agreeing to our use of cookies. OK

License