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bn:00167861n
Noun Concept
Categories: Engineering stubs, Electronics stubs, All articles needing additional references, Semiconductor device fabrication
EN
die preparation  Dicing  Semiconductor-die cutting  wafer mounting
EN
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. Wikipedia
Definitions
Relations
Sources
EN
Die preparation is a step of semiconductor device fabrication during which a wafer is prepared for IC packaging and IC testing. Wikipedia
IS A
manufacturing process
PART OF
semiconductor device fabrication
USES
die
Wikipedia
EN
die preparation
Wikidata
EN
Die preparation
Wikipedia Redirections
EN
Semiconductor-die cutting, wafer mounting
Wikidata Alias
EN
Dicing

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