Login Preferences
About News Publications Statistics Downloads API Guide License How to use Preferences
bn:02036189n
Noun Concept
Categories: Electronics manufacturing, Electronic design, Printed circuit board manufacturing
EN
via  IPC 4761 type I  IPC 4761 type II  IPC 4761 Type III  IPC 4761 Type III-a
EN
A via is an electrical connection between two or more metal layers, and are commonly used in printed circuit boards. Wikipedia
English:
electronics
Definitions
Relations
Sources
EN
A via is an electrical connection between two or more metal layers, and are commonly used in printed circuit boards. Wikipedia
A through-connection Wikipedia Disambiguation
Connection between layers in an electronic circuit Wikidata
A small hole in a printed circuit board filled with metal which connects two or more layers. Wiktionary
IS A
electrical connection
PART OF
circuit board
HAS KIND
microvia
Wikipedia
EN
via (electronics)
Wikidata
EN
via
Wiktionary
EN
via
Wikipedia Redirections
EN
Blind micro via, Blind microvia, Blind via, Buried via, castellated hole, Copper capped via, Covered annular ring, Covered via, Deep vertical interconnect access, DVIA (electronics), Filled & capped via, Filled & covered via, Filled and capped via, Filled and covered via, Filled micro-via, Filled microvia, IPC 4761, IPC 4761 Type I, IPC 4761 type I, IPC 4761 type I via, IPC 4761 Type II, IPC 4761 type II, IPC 4761 type II via, IPC 4761 Type III, IPC 4761 type III, IPC 4761 Type III-a, IPC 4761 type III-a, IPC 4761 type III-a via, IPC 4761 Type III-b, IPC 4761 type III-b, IPC 4761 type III-b via, IPC 4761 type III via, IPC 4761 Type IV, IPC 4761 type IV, IPC 4761 type IV-a, IPC 4761 Type IV-a, IPC 4761 type IV-a via, IPC 4761 type IV-b, IPC 4761 Type IV-b, IPC 4761 type IV-b via, IPC 4761 type IV via, IPC 4761 Type V, IPC 4761 type V, IPC 4761 type V via, IPC 4761 Type VI, IPC 4761 type VI, IPC 4761 type VI-a, IPC 4761 Type VI-a, IPC 4761 type VI-a via, IPC 4761 type VI-b, IPC 4761 Type VI-b, IPC 4761 type VI-b via, IPC 4761 type VI via, IPC 4761 Type VII, IPC 4761 type VII, IPC 4761 type VII via, IPC type I via, IPC type II via, IPC type III-a via, IPC type III-b via, IPC type III via, IPC type IV-a via, IPC type IV-b via, IPC type IV via, IPC type V via, IPC type VI-a via, IPC type VI-b via, IPC type VI via, IPC type VII via, Liquid photoimageable solder mask tenting, LPI tenting, Micro-via filling, Microvia filling, Non-through via, Non-through via hole, Non-thru via, Non-thru via hole, Non Through Via, Pad stack, Padstack, PCB Via, PCB via tenting, Plugged & covered via, Plugged and covered via, Plugged buried via, Plugged via, Tent a via, Tented & covered via, Tented and covered via, Tenting (via), Tenting a via, Tenting via, Thermal via, Thermovia, through-glass via, Through via, Through Via, Through via hole, Type I via, Type II via, Type III-a via, Type III-b via, Type III via, Type IV-a via, Type IV-b via, Type IV via, Type V via, Type VI-a via, Type VI-b via, Type VI via, Type VII via, Vertical interconnect access, Vertical Interconnect Access, Via-hole, Via-in-pad, Via cap, Via capping, Via fill, Via filling, Via hole, Via plug, Via plugging, Via stack, Via tenting, Viastack
Wikidata Alias
EN
vertical interconnect access, VIA

Please note that, in order to improve your browsing experience on this website, BabelNet® uses various types of cookies, including: browsing functionality, performance and statistical cookies.

By continuing to browse the site you are agreeing to our use of cookies. OK

License