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bn:16653855n
Noun Concept
Categories: Electronics manufacturing, Electronic engineering, Electronics substrates, Printed circuit board manufacturing
EN
microvia  1-level microvia  2-level microvia  2-level stacked microvia  3-level microvia
EN
Microvias are used as the interconnects between layers in high density interconnect substrates and printed circuit boards to accommodate the high input/output density of advanced packages. Wikipedia
Definitions
Relations
Sources
EN
Microvias are used as the interconnects between layers in high density interconnect substrates and printed circuit boards to accommodate the high input/output density of advanced packages. Wikipedia
interconnect between layers in HDI substrates and PCBs Wikidata
IS A
via
FACET OF
DE
HDI-Leiterplatte
Wikipedia
EN
microvia
Wikidata
EN
Microvia
Wikipedia Redirections
EN
1-level microvia, 2-level microvia, 2-level stacked microvia, 3-level microvia, 3-level stacked microvia, 4-level microvia, 4-level stacked microvia, Buried microvia, Closed microvia, Four-level microvia, Four-level stacked microvia, Micro-via, Micro via, Plated closed microvia, Screen-printed closed microvia, single-level microvia, Single-level unfilled microvia, stacked microvia, Three-level microvia, Three-level stacked microvia, Two-level microvia, Two-level stacked microvia, Unfilled microvia

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